As a highly skilled RF/microwave technology & product development company, MTI's core competence includes:
ODU Application Technology - Weather-Proof Package Design - Heat Dissipation Simulation & Thermal Analysis - Lightning / Surge Protection Design - RF Plus MCU control technology for Temperature compensation - High Linearity & Sensitivity XCVR Design
Highly integrated microwave, mmWave module, and subsystem design - Various Linearization Technology - RF Pre-Distorter / Digital Pre-Distorter and Feed-Forward - Heat Dissipation Design - Enclosure / Heat Sink Design Capability & Thermal Flow Simulation - Shielding and PCB Layout Experience For EMI/EMC Performance
Chip On Board Design up to Ka Band For Thermal Dissipation and Compact Size
Thin Film MCM ( Multi-Chip Module) up to 38GHz For Low Cost Design Structure and Compact Size
High linearity and high power mobile base station module design The above core technology has been successfully built into our full range telecommunication and satellite communication products. In addition, in order to fulfill the emerging market demand for broadband networks, MTI has also been migrating to the new technology of broadband wireless access system.